With the increased computing power available within new mobile devices, users are creating and consuming more digital content than ever before. This has lead to an increase in the data which must be quickly transmitted both within the device, but more importantly between devices. New technologies for wireless and wired communication such as 5G and USB 3.2 have been developed to allow large amounts of data to be transmitted with low latency. These new technologies however also require advancements in associated component technologies, including interconnects, to enable them to operate as advertised.
Since these consumer devices must remain portable, it is also important to keep the size of the devices as small as possible to give the best user experience. With more technology and hardware features added continuously, size reduction of components inside of devices is further emphasized.
In order to meet all of these new requirements, JAE is developing the new WP16RK Series board-to-board (FPC) connector with excellent signal integrity performance and shielding to ensure high speed data can be transmitted with very little signal loss and EMI radiation.